How Is the Development of AI Technology Impacting the PCB Industry?

Most PCB factories in China commence operations after the Lunar Lantern Festival, which falls on the fifteenth day of the first lunar month. However, the competition in the capital market has already been in full swing a week prior. On January 31, 2025, NVIDIA announced the launch of the DeepSeek-R1 model on NVIDIA NIM. During the same period, both Amazon and Microsoft also integrated the DeepSeek-R1 model. NVIDIA claimed that DeepSeek-R1 is the most advanced large language model. In February 2025, several renowned domestic automobile companies completed in-depth technical integration with the DeepSeek model, achieving another evolution in intelligent cockpits. Subsequently, the application of DeepSeek will also be introduced into the government service systems across the country. 

As mentioned in the previous article What Has the Rise of the New Energy Vehicle Market Brought to the PCB Industry? Artificial intelligence and autonomous driving are poised to bring substantial growth opportunities to the PCB industry. The recent dazzling debut of DEEPSEEK in China has once again propelled artificial intelligence into the global spotlight, following the advent of ChatGPT. The demand for high-end PCB markets is also becoming increasingly evident. With the evolution of optical modules from 400G to 800G speeds, there is a significant push towards the development of technologies such as Co-Packaged Optics (CPO) and Printed Circuit Boards (PCB) that are high-speed, high-density, and have excellent thermal management. These technologies will be widely applied in high-speed data communication and networking, particularly in data centers and high-performance computing environments.

The rapid advancement of artificial intelligence is driving the growth in demand for IC substrates. High-performance AI chips are increasingly adopting Chiplet advanced packaging technology, which requires PCBs to offer higher integration and reliability. Industry experts point out that the widespread adoption of Chiplet packaging technology will further increase the demand for high-end PCBs, especially as multiple companies collaborate with various partners to jointly promote technological upgrades and market expansion.

The swift progression of artificial intelligence has not only catalyzed an explosive surge in demand for the PCB industry but also presented enterprises with the opportunity to advance into high-end markets. The need for high-performance PCBs remains robust across various AI applications, including servers, data centers, autonomous driving, and smart devices.

As the "neural network" of electronic equipment, PCBs are infusing new vitality into various industries through material upgrades and technological breakthroughs. From data centers to AI servers, from consumer electronics to military equipment, the application scope of PCBs is becoming more extensive. Moreover, the localization process of core materials such as high-end copper foil will provide strong support for the industry's development.

As electronic devices trend towards miniaturization and high performance, the high precision, high density, and high reliability of PCBs have become crucial. Particularly driven by emerging technologies such as 5G communication, the Internet of Things, and artificial intelligence, the demand for PCBs continues to grow, making them an indispensable component of modern electronics industry.

Our FASTPCB, as a PCB enterprise that prioritizes quality and establishes itself through technology in China, our company places great emphasis on the opportunities arising from the development of downstream emerging sectors. We are closely capitalizing on the sustained growth in global computing power demand, which presents significant opportunities for the computing power industry chain, including AI servers, data centers, and optical communication. Our supporting PCB products have already been implemented in fields such as AI servers and optical communication.  

FASTPCB is intensifying its research and development efforts, achieving technological breakthroughs through the adoption of new materials, processes, and technologies. These advancements not only enhance the performance and quality of PCBs but also provide robust support for the development of emerging fields.

In the future, as China PCB manufacturings receive policy support, they will enhance their competitiveness through technological innovation, capacity expansion, and overseas investments. PCB companies should continue to increase their R&D investments, boost the production capacity of high-end PCB products, strengthen industrial chain collaboration, and promote the high-end upgrading of the industry, thereby aiding China's journey towards becoming a global powerhouse in high-end PCB manufacturing. To seize the opportunities presented by the high-end market and advance towards global leadership in high-end PCB manufacturing, China PCB factories need to ramp up their R&D efforts, elevate their technological standards, and optimize their industrial layout. Simultaneously, it is crucial to enhance cooperation and exchange with internationally advanced enterprises, introduce cutting-edge technologies and management expertise, and improve their own competitiveness.